LS-BGA676C-22 Land Sockets (Chip Carrier)(LS); Top Package Code: BGA676C; Bottom Package Code: Top Pitch (mm): 1; Bottom Pitch (mm): 1; Top Pin Count: 676; Bottom Pin Count: 676; Top Array Size: 26 x 26; Bottom Array Size: 26 x 26; Top Interface: Surface Mount Land Pattern; Bottom Interface: Female Receptacle; Compatible Part 1: SF-BGA676C-B-11; Part Description: BGA Land Socket;
LS-BGA388B-05 BGA-05 Thru Hole Adapters for GHz Sockets; Top Pitch (mm): 1; IC Size X (mm): 27; IC Size Y (mm): 27; IC Array X: 26; IC Array Y: 26; Compatible Part 1: SG-BGA-6009; Compatible Part 2: SG-BGA-6063; Compatible Part 3: SG-BGA-6068; Compatible Part 4: SG-BGA-6098; Compatible Part 5: SG-BGA-6107; Part Description: GHz Socket SMT Adapter;
LS-BGA388A-05 BGA-05 Thru Hole Adapters for GHz Sockets; Top Pitch (mm): 1.27; IC Size X (mm): 35; IC Size Y (mm): 35; IC Array X: 26; IC Array Y: 26; Compatible Part 1: SG-BGA-6013; Compatible Part 2: SG-BGA-6122; Compatible Part 3: N/A; Compatible Part 4: N/A; Compatible Part 5: N/A; Part Description: GHz Socket SMT Adapter;
LS-BGA289A-05 BGA-05 Thru Hole Adapters for GHz Sockets; Top Pitch (mm): 1.27; IC Size X (mm): 23; IC Size Y (mm): 23; IC Array X: 17; IC Array Y: 17; Compatible Part 1: SG-BGA-6043; Compatible Part 2: N/A; Compatible Part 3: N/A; Compatible Part 4: N/A; Compatible Part 5: N/A; Part Description: GHz Socket SMT Adapter;